Panel and Pattern Plating Production Line

Fully automatic line for production of printed circuit boards one circulating air dryer with 3 working positions • 8 copper and 1 tin stations • 83 positions, incl. 13 Storage positions • 20 vibratory flight bars • integrated metal stripping station (2 stations) • registering a job with or without goods movement • 3 hoists with drip tray • frequency converters for variable drive and brake speeds two electroless copper tanks with semi-automatic chemistry transfer and cleaning process • line is designed for limited spaces • automatic copper dissolving station for supply of copper oxide, with crane as supporting tool • copper via filling tank with horizontal movable nozzle register for electrolytic upstream flow on printed circuit boards • last generation of insoluble anodes in all copper plating tanks • floating blending shields for different sizes of printed circuit boards • process: electroless copper, electrolytic copper with via filling and electrolytic tin.